You most likely don't need to reball and probably should not attempt that anyways.
The SAFEST thing for you to do is just use a reflow oven. The non-leaded solder balls melt around 226c. 300c is way too high and will burn up any IC. Max temp is 240c, and even that is on the rather high side.
Using those dinky IR preheater stations and a hot air station is bound to leave the PCB warped and then the Cell or RSX (whichever you are trying to reflow) will not sit properly and the PS3 will end up not firing up.