But if you really want to use the 'blob' method, make sure the ground point on the motherboard is shiny (fiberglass pen) and has flux on it.
Melt a fair amount of solder onto the point and begin raising your iron tip as the solder flows and it should start stacking up until it connects with the chip point.
This method will use quite a bit more solder than wire.
I no longer use this method since a ground point came unstuck from the motherboard during shipping.
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