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[langtitle=it]come saldare questi punti????[/langtitle]
[lang=it]130 visite e nessun aiuto ...... aiutatemi please[/lang]
Last edited by federic1994; 04-02-2011 at 02:36 PM.
some 30awg wire and a steady hand with solder iron
[lang=it]ma e lo stagno che non resta attacato al scheda. comunque io utilizzo il filo 30lwg[/lang]
are you using flux? sometimes solder doesn't stick if you don't use flux first
[lang=it]no. ho provato solo con la pasta salda[/lang]
If you're new to soldering, you may want to practice on something else first.
First, apply flux to the wire. Next, touch the soldering iron to the wire (the flux will smoke, don't breathe the fumes). Once the wire is hot, touch the solder to the wire. The solder should flow onto the wire and cover all the areas where the flux was. This is known as "tinning" the wire and will make soldering easier. If the electrical component you want to solder the wire to doesn't have solder on it already, it needs to be tinned too. Next, touch the wire to the component. Next, touch the soldering iron to the wire just above the component. The solder on the wire and on the component should melt together. Remove the soldering iron while holding the wire in place. In two seconds the solder will have cooled bonding the pieces together.
Don't apply too much heat to the circuit board or you may desolder some components.
Don't apply too much solder or you may create a solder bridge.
[lang=it]gia fatto ma niente si stacca continuamente il filo.[/lang]
I had more difficulty getting these spots to stick than the W connection due to them being round. I wasn't able to get solder to stick to these pads (at least not enough) so I did it the wrong way and got a little extra solder on the tip of the 30awg wire, got it to adhere to the tinned pad, then used a little dab of hot glue to keep it from wiggling around. Is it an iffy connection? Most certainly. But the chip was functioning as far as I could tell.