A soldering question.
Have seen alot of the jobs you guys make.
ANd i can't help noticing that for the "MI" and prolly other chips.
You seem to use abnormally large wires for ground and 3.3V, why??
And can't you use the normal thickness wires for them?
Oh and someone please check the pic.
Ground is soldered to a place that is not mentioned in the V7 diagram for MI.
Why is it soldered to that place??
It comes down to good soldering practice... nothing more. Call it insurance, if you will. What you don't want is wire on the POWER/GROUND that is too thin, causing resistance on the line. This is particulary important for these two wires.
Many an installer uses 30 guage for all wiring, including the POWER/GROUND. The DUO and Magic line had no problems with 30 guage across the board. On the other hand, any installer of the DeeEmmEss line knows full-well the reason behind thicker wiring on these points. So, common sense and solid soldering practice would suggest sticking with 22 (or so) guage on these two points.
The entire copper border around the mainboard is GROUND... it can be soldered to at any point.