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Magic 3.6 pad came off
Magic 3.6 pad came off –
It was the pad marked in green on the attached picture. The BGA board would not stay close to the ps2 board after it was soldered and when I tried to resolder it the pad marked in green came off of the ps2 board. The point is on on the back where the L shaped BGA board gets soldered too.
My ps2 wont boot now, even with the chip completely uninstalled, it boots up but all that shows up is a black screen.
Is there any fix for that?????
Scratch the trace before and after the pad and solder a bridge.
Not easy but can be done